KLK Undergraduate Scholarship at Malaysian Institutions of Higher Learning, 2018

Scholarship Description:

The Kuala Lumpur Kepong Berhad now invites scholarship applications from qualified and deserving individuals seeking financial assistance in pursuing their full-time undergraduate studies in Malaysian institutions of higher learning.

Host College/University:

The Kuala Lumpur Kepong Berhad (“KLK”) is a company incorporated in Malaysia and listed on the Main Market of Bursa Malaysia Securities Berhad with a market capitalisation of approximately RM26.7 billion at the end of December 2017.

Degree level:

Scholarship is available to pursue undergraduate programme.

Field of Study:

Scholarship is awarded in the fields of:

  1. Agricultural Sciences or related disciplines
  2. Sciences (Chemistry, Biotech)
  3. Engineering (Chemical, Mechanical, Civil, Electrical & Electronics)
  4. Accountancy
  5. Information Technology
  6. Architecture
  7. Real Estate Management
  8. Town & Regional Planning

Scholarship Award: 

Scholarship of value Degree: RM10, 000 per academic year.


  • Scholarship is available for Malaysian citizens.
  • Numbers not given
  • Scholarship can be taken in Malaysia

Eligibility Criteria:

Entrance Requirements: Applicants must meet the following criteria:

  • Must be a Malaysian citizen
  • Good academic results (STPM, A-Levels or equivalent minimum 2As / Foundation-minimum CGPA of 3.5)
  • Good command of English both written and spoken
  • A record of active participation in extracurricular activities
  • Must have a confirmed placement from institutions of higher learning
  • Not bonded, holding any other scholarship or receiving assistance from any organisation
  • Be prepared to serve a 3 year bond with the Group at any location upon graduation.

Applying procedure Instructions:

How to Apply: 

Download the application form. The completed form, certificates and offer letter from the institution are to be sent by post.

Scholarship Official Web Links:

Scholarship Link: ◄–

Scholarship Deadline:

August 24, 2018.

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